TSMC Unveils Roadmap for Advanced 2nm and 1.6nm Semiconductor Processes
April 24, 2025
TSMC
Semiconductor
2nm
1.6nm
Gate-All-Around
High-Performance Computing
Mobile Applications
TSMC has announced its roadmap for advanced semiconductor manufacturing, including the 2nm (N2), N2P, and 1.6nm (A16) processes, with high-volume production set to begin between 2025 and 2026, promising significant improvements in performance, power efficiency, and transistor density.
TSMC Unveils Roadmap for Advanced 2nm and 1.6nm Semiconductor Processes
TSMC has outlined a detailed roadmap for its advanced semiconductor manufacturing processes, including the 2nm (N2), A16, and N2P nodes. Here’s the timeline and key details:
- N2 Process (2nm): TSMC's N2 process is set to enter high-volume manufacturing (HVM) in the second half of 2025. This will be TSMC's first node to utilize gate-all-around (GAA) nanosheet transistors, offering significant improvements in performance, power efficiency, and transistor density. Compared to the N3E process, N2 is expected to reduce power consumption by 25%-30%, increase performance by 10%-15%, and boost transistor density by 15%.
- N2P Process (Performance-Enhanced 2nm): Scheduled for HVM in 2026, N2P is an enhanced version of the N2 process. It is expected to deliver a 5%-10% reduction in power consumption or a 5%-10% increase in performance compared to the original N2 node.
- A16 Process (1.6nm): TSMC's A16 process is slated to begin production in 2026. It will feature advanced backside power delivery and GAA nanosheet transistors, offering an 8%-10% performance improvement or a 15%-20% power reduction compared to N2P. A16 is designed for ultra-high-performance applications, though it will be more expensive due to the complexity of backside power delivery.
These advancements position TSMC to maintain its leadership in semiconductor manufacturing, particularly in high-performance computing and mobile applications. For more detailed insights, you can refer to the AnandTech article and the Evertiq report.