xMEMS Unveils Groundbreaking XMC-2400 µCooling Chip for AI Data Centers
xMEMS Unveils Groundbreaking XMC-2400 µCooling Chip for AI Data Centers
xMEMS has introduced a groundbreaking innovation in thermal management with its xMEMS XMC-2400 µCooling chip, designed specifically for AI applications, including data centers. This all-silicon, active micro-cooling fan is the industry’s first of its kind, offering a compact and efficient solution for cooling high-performance devices.
The XMC-2400 measures just 9.26 x 7.6 x 1.08 millimeters and weighs under 150 milligrams, making it 96% smaller and lighter than traditional cooling alternatives. It is capable of moving up to 39 cubic centimeters of air per second with 1,000Pa of back pressure, ensuring effective cooling even in the most demanding environments.
This technology is particularly significant for AI data centers, where thermal management is a critical challenge due to the high computational loads and heat generation. The XMC-2400’s solid-state design ensures silent, vibration-free operation, making it ideal for integration into data center infrastructure without compromising performance or reliability.
xMEMS plans to sample the XMC-2400 to customers in Q1 2025, with production set to begin in Q2 2025. This innovation is expected to revolutionize thermal management in AI data centers, enabling thinner, more efficient, and high-performance devices.
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